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Technical Presentation and Lunch - Tuesday, September 26th
High-Frequency Characterization of Chip Package Substrates
Interconnects in chip packages cause signal attenuation and crosstalk, which limit the speed of radio-frequency and high-speed-digital systems. High-frequency performance of interconnects depends on the dielectric constant (DK) and loss tangent (DF) of the substrate. Precise embedded RF components and impedance control also require accuracy of dielectric thickness (DT). Hence, determination of these properties is necessary for designing robust chip packages that can support faster signals. DK and DF of dielectrics are commonly measured by vendors using split-post resonators at a single frequency. However, the complex permittivity of a dielectric changes with frequency. As high-speed and high-frequency designs continue to evolve, precision of interconnect models for signal/power integrity analysis and RF design is becoming very critical. An accurate methodology based on RF measurement of test coupons will be presented to capture the variation of DK and DF with frequency and DT across different panels of substrates.
Dr. Ege Engin is an Associate Professor in the Department of Electrical and Computer Engineering at San Diego State University. He is the co-author of the book “Power Integrity Modeling and Design for Semiconductors and Systems,” translated into Chinese and Japanese. He is the recipient of the Semiconductor Research Corporation Inventor Recognition Award in 2009, and the Outstanding Educator Award from IMAPS in 2015. Dr. Engin is an Alexander-von-Humboldt Research Fellow.
Tuesday, September 26th at Noon. Lunch provided.
Kyocera International, Inc.
8611 Balboa Avenue
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