NEXT EVENT: 

 

*POSTPONED UNTIL FURTHER NOTICE*

Electronic Packaging: The Next 20 Years


Presented by: Intel, Beth Keser, Ph.D, Director of Packaging Engineering

​Sponsored by StratEdge

Abstract:

​​

The future of electronic packaging is bright for package engineer as many new applications depend on advanced packaging solutions rather than Moore’s Law for improved performance and cost. Current mechanical, thermal, material, and electrical issues will multiply as solutions are required for heterogeneous integration, high reliability, low power, low loss, good thermal and electrical performance, and optimized cost and footprint. Advances in Fan-Out Wafer and Panel Level Packaging are adding value to the mobile, automotive, and IoT industries, but new package architectures and designs are needed to address 5G, Autonomous Driving, Artificial Intelligence, and Virtual/Augmented Reality. There are many packaging challenges ahead and significant advancements will be required in package innovation over the next 20 years.


Register HERE for tickets

Members: $20

Non-members: $25

Students with ID: $10

​**Space is limited to 30 registrants due to room size, so please sign up quickly. Lunch will be provided.


Logistics:


Time: 1pm - 2pm

Location: EMD Performance Materials, 6555 Nancy Ridge Drive, Suite #200, San Diego, CA 92123

 

2020 Technical Presentations:

  • AI Platform - Hardware and Software Integration for Precise Maneuverability - Shield Al's Mr. Mark White, Principle Engineer
  • ​​Evolution of mmWave, Semiconductors, Antennae/interfaces, eWLB, to 60GHz BGA derives, and more... - Vubiq Networks, Mike Pettus, Founder & CTO

2019 Technical Presentations:​

  • High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD
  • DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D
  • Lunch & Learn Speaker Session

2018 Technical Presentations:

  • ​Precise Characterization of Multipin Connectors - ​Enow Tanjong
  • Microscale Universal Sensor System (MUSS) - ​Dr. Visarath In
  • Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging ​​Hanzhuang “Hannah” Liang, PhD
  • High-Frequency Characterization of Chip Package Substrates Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)


2017 Technical Presentations:


2016 Technical Presentations:

  • TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
  • Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  • Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  • How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
    • Download a copy of Ken's presentation HERE
  • New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies


2015 Technical Presentations:

  • Nanofabricated Electronic Components - Carl Edwards, Space Micro
  • FOWLP Technology and Application Space - Beth Keser, Qualcomm
  • Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  • Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  • Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  • CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  • Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

 
2014 Technical Presentations:

  • Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  • Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
    • Download a copy of Tim's presentation HERE
  • SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
    • Download a copy of Rich's presentation HERE
  • Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  • Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies


2013 Technical Presentations:

  • Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  • Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  • Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine

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