2017 Technical Presentations:


2016 Technical Presentations:

  • TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
  • Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  • Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  • How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
    • Download a copy of Ken's presentation HERE
  • New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies


2015 Technical Presentations:

  • Nanofabricated Electronic Components - Carl Edwards, Space Micro
  • FOWLP Technology and Application Space - Beth Keser, Qualcomm
  • Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  • Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  • Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  • CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  • Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

 
2014 Technical Presentations:

  • Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  • Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
    • Download a copy of Tim's presentation HERE
  • SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
    • Download a copy of Rich's presentation HERE
  • Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  • Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies


2013 Technical Presentations:

  • Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  • Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  • Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine

NEXT MEETING


Technical Presentation and Lunch - Tuesday, September 26th

High-Frequency Characterization of Chip Package Substrates

  • $20.00 for IMAPS members
  • $25.00 for non-members
  • FREE for Students with ID
  • RSVP Required. Space is limited so please sign up quickly! 






Abstract:
Interconnects in chip packages cause signal attenuation and crosstalk, which limit the speed of radio-frequency and high-speed-digital systems. High-frequency performance of interconnects depends on the dielectric constant (DK) and loss tangent (DF) of the substrate. Precise embedded RF components and impedance control also require accuracy of dielectric thickness (DT). Hence, determination of these properties is necessary for designing robust chip packages that can support faster signals. DK and DF of dielectrics are commonly measured by vendors using split-post resonators at a single frequency. However, the complex permittivity of a dielectric changes with frequency. As high-speed and high-frequency designs continue to evolve, precision of interconnect models for signal/power integrity analysis and RF design is becoming very critical. An accurate methodology based on RF measurement of test coupons will be presented to capture the variation of DK and DF with frequency and DT across different panels of substrates.


Presenter:
Dr. Ege Engin is an Associate Professor in the Department of Electrical and Computer Engineering at San Diego State University. He is the co-author of the book “Power Integrity Modeling and Design for Semiconductors and Systems,” translated into Chinese and Japanese. He is the recipient of the Semiconductor Research Corporation Inventor Recognition Award in 2009, and the Outstanding Educator Award from IMAPS in 2015. Dr. Engin is an Alexander-von-Humboldt Research Fellow.



Logistics:
Tuesday, September 26th at Noon.  Lunch provided.


Kyocera International, Inc.
8611 Balboa Avenue

San Diego, CA 92123

PREVIOUS MEETINGS


View our previous technical presentation topics and abstracts, and download presentations that our speakers have made available to our community.