NEXT MEETING: 


Microscale Universal Sensor System (MUSS)

Tuesday, April 24th, 2018 at 12:00 pm 


TBD

  • $20.00 for IMAPS members
  • $25.00 for non-members
  • FREE for Students with ID
  • RSVP Required. Space is limited so please sign up quickly! 






Abstract:
See Flyer


Presenter:
Dr. Visarath In



Logistics:

Location: EMD Performance Materials @ 6555 Nancy Ridge Dr, San Diego, CA 92131




PREVIOUS MEETINGS


View our previous technical presentation topics and abstracts, and download presentations that our speakers have made available to our community.

2017 Technical Presentations:


2016 Technical Presentations:

  • TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
  • Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  • Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  • How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
    • Download a copy of Ken's presentation HERE
  • New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies


2015 Technical Presentations:

  • Nanofabricated Electronic Components - Carl Edwards, Space Micro
  • FOWLP Technology and Application Space - Beth Keser, Qualcomm
  • Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  • Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  • Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  • CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  • Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

 
2014 Technical Presentations:

  • Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  • Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
    • Download a copy of Tim's presentation HERE
  • SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
    • Download a copy of Rich's presentation HERE
  • Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  • Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies


2013 Technical Presentations:

  • Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  • Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  • Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine