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View our previous technical presentation topics and abstracts, and download presentations that our speakers have made available to our community.

NEXT EVENT: 

 

October Fest

Thursday, October 24th, 2019

5:30-7:30 pm

 



Abstract:
 Join San Diego Joint Chapters of ACerS & IMAPS for a joint social together with IPC Designers Council & SMTA for Octoberfest!


See flyer for more details.

 





Logistics:


Location:

Karl Strauss Brewing Company - Sorrento Mesa

9675 Scranton Road, San Diego, CA 92121 


 

2019 Technical Presentations:​

  • High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD
  • DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D
  • Lunch & Learn Speaker Session

2018 Technical Presentations:

  • ​Precise Characterization of Multipin Connectors - ​Enow Tanjong
  • Microscale Universal Sensor System (MUSS) - ​Dr. Visarath In
  • Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging ​​Hanzhuang “Hannah” Liang, PhD
  • High-Frequency Characterization of Chip Package Substrates Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)


2017 Technical Presentations:


2016 Technical Presentations:

  • TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
  • Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  • Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  • How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
    • Download a copy of Ken's presentation HERE
  • New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies


2015 Technical Presentations:

  • Nanofabricated Electronic Components - Carl Edwards, Space Micro
  • FOWLP Technology and Application Space - Beth Keser, Qualcomm
  • Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  • Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  • Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  • CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  • Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

 
2014 Technical Presentations:

  • Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  • Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
    • Download a copy of Tim's presentation HERE
  • SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
    • Download a copy of Rich's presentation HERE
  • Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  • Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies


2013 Technical Presentations:

  • Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  • Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  • Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine